IC Sockets - A Global Strategic Business Report

I.INTRODUCTION, METHODOLOGY & PRODUCT DEFINITIONS

Study Reliability and Reporting Limitations

Disclaimers

Data Interpretation & Reporting Level

Quantitative Techniques & Analytics

Product Definitions and Scope of Study

IC Sockets

1. Dual In-Line Memory Module (DIMM) Sockets

2. Production Sockets

3. Test/Burn-in Sockets

4. Other Sockets

II. EXECUTIVE SUMMARY

1.INDUSTRY OVERVIEW

Preface

Global Outlook

Analysis by Region

Analysis by Product Segment

Impact of Recession on IC Sockets Market

Changing Market Dynamics

Evolving IC Sockets Market

Evolving Production IC Sockets Segment

Test and Burn-In Sockets Segment to Witness New Developments

IC Socket Industry Witnesses Growth of EMS Companies

Connector Industry

2.PRODUCT OVERVIEW

Introduction

IC Sockets

Performance Specifications

Components of IC Socket

Contact Designs Used in IC Sockets

Types of IC Sockets

Dual In-Line Memory Module (DIMM) Sockets

Production Sockets

Plastic Leaded Chip Carrier (PLCC) Socket

Pin Grid Array (PGA) Socket

Land Grid Array (LGA) Socket

Test/Burn-in Sockets

Other Sockets

Dual In-Line Package (DIP) Socket

Ball Grid Array (BGA) Socket

Specialty Socket

Interposer

Advantages of IC Sockets

Cost Savings

Component Repair and Replacement

Avoidance of Direct Soldering

Flexibility in Assembly, IC Design, and Supply-Chain Management

Component Exchange and Upgrade

Component Burn-in and Test

Disadvantages of IC Sockets

End-Use Applications of IC Sockets

Services and Products Associated with IC Sockets

IC Sockets and Interconnect Components

IC Package Converters and Adapters

PCB Pins and Receptacles

IC Pin Probes

3.PRODUCT INTRODUCTIONS/INNOVATIONS

Ironwood Electronics Launches a Range of New BGA Sockets

Ironwood Electronics Introduces New QFN Socket

Ironwood Electronics Launches High Performance BGA Socket

Aries Electronics Expands CSP/µBGA Test/Burn- in Sockets Range

Plastronics Launches ES Socket System

Thermaltake Unveils New CPU Cooler with Multiple Sockets

Fujitsu Launches SMT DDR2 DIMM Socket

Emulation Unveils Novel Socket System

MIPS Technologies Unveils Novel Instruction Set and Cores

Aries Electronics Launches CSP/BallNest Hybrid Socket

MiniATE Systems Introduces ET 2300 Socket System

Sullins Connector Solutions Extends Insulation Displacement Connector Portfolio

Fujitsu Asia Introduces PRIMERGY Dual Socket S5 Series

Intel Launches Nehalem Based Processors and LGA Sockets

Quadrant Rolls Out Semitron® MDS 100

Atmel Introduces New Expansion, Routing and Socket Cards

Tyco Electronics Introduces New Range of RFI Filter Connectors

4.RECENT INDUSTRY ACTIVITY

Molex Sockets Earn Intel® Validation

Semiconductor Test Group Merges with Multitest elektronische Systeme and Harbor Electronics

KLA Tencor Acquires ICOS Vision Systems

5.FOCUS ON SELECT GLOBAL PLAYERS

3M Company (US)

Aries Electronics, Inc. (US)

Chupond Precision Co., Ltd. (Taiwan)

Enplas Corporation (Japan)

FCI (France)

Foxconn Technology Group (Taiwan)

Johnstech International Corporation (US)

Loranger International Corporation (US)

Mill-Max Mfg. Corporation (US)

Molex, Inc. (US)

Plastronics Socket Company, Inc. (US)

Sensata Technologies B.V. (The Netherlands)

Tyco Electronics Ltd. (Switzerland)

Win Way Technology Co., Ltd. (Taiwan)

Yamaichi Electronics Co., Ltd. (Japan)

6.GLOBAL MARKET PERSPECTIVE

Table 1: World Recent Past, Current and Future Analysis for IC Sockets by Geographic Region – North America, Japan, Europe, Asia-Pacific and Rest of World Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

Table 2: World 10-Year Perspective for IC Sockets by Geographic Region – Percentage Breakdown of Dollar Sales for North America, Japan, Europe, Asia-Pacific and Rest of World Markets for Years 2006, 2009 and 2015 (includes corresponding Graph/Chart)

Table 3: World Recent Past, Current & Future Analysis for IC Sockets by Product Segment – Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Other IC Socket Markets Independently Analyzed with Annual Sales in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

Table 4: World 10-Year Perspective for IC Sockets by Product Segment – Percentage Breakdown of Dollar Sales for Dual In-Line Memory Module Sockets, Production Sockets, Test/Burn-in Sockets, and Other IC Socket Markets for Years 2006, 2009 & 2015 (includes corresponding Graph/Chart)

III. MARKET

1.NORTH AMERICA

A. Market Analysis

Current and Future Analysis

Impact of Recession on IC Sockets Market

Product Launches/Developments

Strategic Corporate Developments

Select US Players

B. Market Analytics

Table 5: North American Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

2.JAPAN

A. Market Analysis

Current and Future Analysis

Select Players

B. Market Analytics

Table 6: Japanese Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

3.EUROPE

A. Market Analysis

Current and Future Analysis

Product Launch

Strategic Corporate Development

Select Players

B. Market Analytics

Table 7: European Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

4.ASIA-PACIFIC

A. Market Analysis

Current and Future Analysis

Product Launches/Developments

Select Players

B. Market Analytics

Table 8: Asia-Pacific Recent Past, Current and Future Analysis for IC Sockets by Geographic Region – China and Rest of Asia-Pacific Markets Independently Analyzed with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

Table 9: Asia-Pacific 10-Year Perspective for IC Sockets by Geographic Region – Percentage Breakdown of Dollar Sales for China and Rest of Asia-Pacific Markets for Years 2006, 2009 and 2015

5.REST OF WORLD

Market Analysis

Table 10: Rest of World Recent Past, Current and Future Analysis for IC Sockets with Annual Sales Figures in US$ Million for Years 2006 through 2015 (includes corresponding Graph/Chart)

IV. COMPETITIVE LANDSCAPE

Total Companies Profiled: 44 (including Divisions/Subsidiaries - 46)

Region/CountryPlayers

The United States

Japan

Europe

France

Germany

The United Kingdom

Rest of Europe

Asia-Pacific (Excluding Japan)