EDC sails out of LRM harbor
http://www.companiesandmarkets.com/Summary-Market-Report/edc-sails-out-of-lrm-harbor-43636.asp
- Market - Information Technology
- Published Date - 10/04/2008
- Report Type - Market Report
- Country - Global
- Number of Pages - 10
Report Summary
Vendors showcased improved versions of EDC (electronic dispersion compensation) chips at the OFC/NFOEC conference in February. Though all aimed at the LRM modules market initially, EDC chips are now vying for design sockets on system boards that support SFP+ form factors. As uncertainty continues to cloud the LRM market, EDC is tackling additional applications including copper.
Table of Contents
Table of figures
Application drivers changing
LRM now available but still slow to ramp
SFP+ changes the game
EDC for SFP+ must appeal to system designers
System vendors are also customers for backplane applications
What more is needed?
SFP+ still looking for improvement
Technology choices and business strategy
Multiple tech choices make for complex competitive positioning
Digital vs. analog schism is really shades of gray
SerDes vs. CDR schism
Secondary markets emerging
Copper twin-ax and backplane KR included
Business climate
Vendor landscape
Predictions
EDC increasingly part of standard toolkit from backplane to long-haul as speeds move past 10Gbps
Table of figures
Figure 1 XAUI-based SFP+ board design concept
Figure 2 XFP and X2 module applications using CDR with EDC
Table 1 Product comparison of LRM EDC chips